Mikio Komiyama is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of adhesive technologies, holding a total of 6 patents. His innovative work has led to advancements in methods and materials used in various applications.

Latest Patents

One of his latest patents is the "Die-sorting sheet and method for transporting chips having adhesive layer." This invention includes a die-sorting sheet with a pressure-sensitive adhesive layer on the outer periphery, allowing for efficient transportation of chips. Another notable patent is for an "Adhesive tape, base material for adhesive tape and their manufacturing." This patent describes a base material that is radiation-cured, providing a flat surface without defects that can cause issues during semiconductor processing.

Career Highlights

Mikio Komiyama is currently associated with Lintec Corporation, where he continues to develop innovative adhesive solutions. His work has been instrumental in enhancing the performance and reliability of adhesive products used in various industries.

Collaborations

Throughout his career, Komiyama has collaborated with notable colleagues, including Kazuyoshi Ebe and Yasunao Miyazawa. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Mikio Komiyama's contributions to adhesive technologies have made a significant impact in his field. His innovative patents and collaborations highlight his dedication to advancing technology and improving product performance.

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