The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2013

Filed:

Oct. 12, 2007
Applicants:

Akie Hamasaki, Tokyo, JP;

Shino Moritani, Tokyo, JP;

Mikio Komiyama, Tokyo, JP;

Inventors:

Akie Hamasaki, Tokyo, JP;

Shino Moritani, Tokyo, JP;

Mikio Komiyama, Tokyo, JP;

Assignee:

Lintec Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); B32B 3/02 (2006.01); C09J 7/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A die-sorting sheet includes a pressure-sensitive adhesive layer exposed on an outer periphery of the carrier sheet, and a base film exposed on a central area that is inside the outer periphery. A method for transporting a chip having an adhesive layer includes the steps of: providing the above die-sorting sheet that is fixed with a frame through the pressure-sensitive adhesive layer on the outer periphery; temporarily attaching a picked up chip through an adhesive layer thereof onto the base film exposed on the die-sorting sheet; and transporting the die-sorting sheet to a subsequent step while the chip is temporarily attached on the sheet through the adhesive layer.


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