The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2000

Filed:

Mar. 13, 1997
Applicant:
Inventors:

Kouichi Nagamoto, Warabi, JP;

Mikio Komiyama, Warabi, JP;

Kazuyoshi Ebe, Warabi, JP;

Assignee:

Lintec Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J / ;
U.S. Cl.
CPC ...
428343 ; 428345 ; 4283 / ; 4284231 ; 4284244 ;
Abstract

A base material has a radiation-cured material prepared by curing a mixture of urethane acrylate oligomer and reactive dilute monomer, and also it shows a breaking elongation of more than 10%, preferably of more than 100%. The base material is used as a base sheet of an adhesive tape where an adhesive layer is formed on the base sheet. Accordingly, the novel base material and its manufacturing method in addition to an adhesive tape having such base material are provided. Furthermore, the adhesive tape has a flat surface without any fish-eye that causes the troubles of cracking, chip-scattering, and so on in the steps of back-grinding and dicing of the semiconductor wafer, and also the adhesive tape can be processed so as to have a predetermined thickness with high accuracy, compared with that of the conventional one.


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