Mika Koshino

Title: Mika Koshino - Innovator in Semiconductor Technology

Introduction

Mika Koshino is a talented inventor based in Otsu-shi, Japan. She has made significant contributions to the field of semiconductor technology. Her innovative approaches focus on improving the efficiency and effectiveness of semiconductor device manufacturing.

Latest Patent Applications

Mika Koshino has filed several notable patent applications. One of her latest applications is for a laminate, resin composition, and method for manufacturing semiconductor devices. This invention provides a laminate that allows semiconductor elements to be transferred over a wide range of processing margins using lasers of various wavelengths, without damaging the elements or leaving behind any pasty residue. The laminate consists of a laser-transmitting substrate, a resin film, and a semiconductor element laminated in that order. The absorbance of the resin film at wavelengths of 248 nm, 266 nm, or 355 nm, expressed in terms of a film thickness of 1.0 μm, ranges from 0.4 to 5.0. Additionally, the adhesive strength of the resin film with respect to the semiconductor elements is between 0.02 and 0.3 N/cm. Another application focuses on a laminate and manufacturing method of semiconductor devices, which can be implemented with a wide processing margin and without adhesive residue or damage to a semiconductor element during transfer using laser light of various wavelengths. This laminate is obtained by laminating a substrate with laser permeability, a resin film 1, and a resin film 2 in that order. The light absorbance of resin film 1, calculated for a film thickness of 1.0 μm at any wavelength from 200 nm to 1100 nm, is also between 0.4 and 5.0, with the adhesive strength of the surface of resin film 2 on the side opposite that of resin film 1 being 0.02 to 0.3 N/cm.

Conclusion

Mika Koshino is an innovative inventor whose work in semiconductor technology is paving the way for advancements in the field. Her latest patent applications demonstrate her commitment to improving manufacturing processes and enhancing the performance of semiconductor devices.