Toray Industries, Inc.

Mika Koshino

Kazuto Miyoshi

Masao Tomikawa

Mitsuhito Suwa

Yusuke Komori

Provided is a resin composition which contains a UV absorbent having high solubility in solvents, and imparts superior UV-cut performance and transparency, and good weather resistance, even when being formed as a thin film. The resin composition contains a UV absorbent (a) and a resin (b), wherein the UV absorbent (a) contains at least two compounds, i.e., a compound (a-1) having a global absorption maximum at less than 340 nm, and a compound (a-2) having a global absorption maximum at 340-380 nm, and the total content of (a-1) and (a-2) is 10-30 mass % of the total solid content.

Resin composition, cured film, method for producing cured film, and display device

The present invention provides a photosensitive resin composition which uses a polyimide precursor that has excellent solubility in organic solvents and is capable of reducing the viscosity of a resin composition obtained therefrom. The solution according to the present invention is a photosensitive resin composition which contains: an aromatic amide resin that has, as a main repeating unit, a specific structure having an amide group, a trifluoromethyl group and an aromatic ring; (b) a sensitizer; and (c) a solvent.

Photosensitive resin composition, method for producing heat-resistant resin film and display device

The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.

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Otsu, Japan

Mika Koshino