The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Mar. 10, 2014
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Assignee:
Toray Industries, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/04 (2006.01); C08L 79/08 (2006.01); C08G 73/22 (2006.01); C08G 73/10 (2006.01); G03F 7/037 (2006.01); C09K 11/06 (2006.01); G02B 1/04 (2006.01); G03F 7/039 (2006.01); H05B 33/10 (2006.01); H05B 33/14 (2006.01); H01L 51/52 (2006.01); G03F 7/00 (2006.01); C08K 5/17 (2006.01); G03F 7/40 (2006.01); H01L 27/32 (2006.01); C08K 5/13 (2006.01);
U.S. Cl.
CPC ...
G02B 1/04 (2013.01); C08G 73/22 (2013.01); C08G 73/10 (2013.01); G03F 7/0007 (2013.01); C08K 5/17 (2013.01); G03F 7/037 (2013.01); C09K 11/06 (2013.01); G03F 7/40 (2013.01); C08L 79/08 (2013.01); C09K 2211/1059 (2013.01); C08L 79/04 (2013.01); C09K 2211/1007 (2013.01); G03F 7/039 (2013.01); H01L 27/3246 (2013.01); H01L 27/322 (2013.01); H05B 33/10 (2013.01); H05B 33/14 (2013.01); C09K 2211/1044 (2013.01); H01L 27/3258 (2013.01); C09K 2211/1014 (2013.01); C08K 5/13 (2013.01); H01L 51/5284 (2013.01);
Abstract
The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.