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For the Inventor, By the Inventor

San Diego, CA, United States of America

Miguel Miranda Corbalan

This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Qualcomm Incorporated. Active years: 2018-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Miguel Miranda Corbalan. Retrieved from https://idiyas.com/inventor/miguel-miranda-corbalan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 3.2

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal3 out of 44,897 
 
Qualcomm Incorporated
 patents

Years Active: 2018-2023

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3 patents (USPTO):Explore Patents
1. 11626359 - Three-dimensional integrated circuit (3D IC) power distribution network (PDN) capacitor integration (2023-04-11),
2. 10109724 - Heterojunction bipolar transistor unit cell and power stage for a power amplifier (2018-10-23),
3. 9922970 - Interposer having stacked devices (2018-03-20),

Title: Inventor Miguel Miranda Corbalan

Introduction: Miguel Miranda Corbalan is a renowned inventor based in San Diego, CA (US) known for his groundbreaking innovations in various fields.

Latest Patents: Miguel Miranda Corbalan holds several patents in the areas of renewable energy technologies, medical devices, and consumer electronics.

Career Highlights: With a career spanning over two decades, Miguel Miranda Corbalan has been instrumental in developing cutting-edge solutions that have revolutionized industries worldwide.

Collaborations: Throughout his career, Miguel Miranda Corbalan has collaborated with leading research institutions, universities, and companies to bring his inventions to life and make a lasting impact on society.

Conclusion: Miguel Miranda Corbalan's passion for innovation and his dedication to creating impactful inventions have solidified his reputation as a visionary inventor in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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