The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2023
Filed:
Apr. 27, 2021
Qualcomm Incorporated, San Diego, CA (US);
Biancun Xie, San Diego, CA (US);
Shree Krishna Pandey, San Diego, CA (US);
Irfan Khan, San Diego, CA (US);
Miguel Miranda Corbalan, San Diego, CA (US);
Stanley Seungchul Song, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
A three-dimensional (3D) integrated circuit (IC) includes a first die. The first die includes a 3D stacked capacitor on a first surface of the first die and coupled to a power distribution network (PDN) of the first die. The 3D IC also includes a second die stacked on the first surface of the first die, proximate the 3D stacked capacitor on the first surface of the first die. The 3D IC further includes active circuitry coupled to the 3D stacked capacitor through the PDN of the first die.