This inventor holds 6 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1989-2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Yorktown Heights, NY (US) (1989 - 2002)
- Essex Junction, VT (US) (2002)
- Essex Junction, DE (2003)
Company Filing History:
Years Active: 1989-2003
Title: Michael Liehr: Innovator in Semiconductor Technology
Introduction
Michael Liehr is a prominent inventor based in Essex Junction, VT (US). He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His innovative approaches have paved the way for advancements in direct chip attachment methods.
Latest Patents
One of Michael Liehr's latest patents is titled "Method for direct chip attach by solder bumps and an underfill layer." This method involves a unique process for attaching a semiconductor chip to a circuit board using solder bumps and an underfill layer. The process begins with screen printing a layer of in-situ polymeric mold material on the semiconductor chip, exposing multiple bond pads. The mold layer is then formed with apertures filled with solder material through a molten solder screening process to create solder bumps. A thin layer of flux-containing underfill material is placed on the circuit board, aligning with the conductive pads. The semiconductor chip and circuit board are pressed together, and the assembly is heated to establish electrical communication between the bond pads and conductive pads. This innovative method replaces traditional underfill materials, streamlining the assembly process.
Career Highlights
Michael Liehr has had a distinguished career at International Business Machines Corporation (IBM). His work has focused on enhancing semiconductor manufacturing processes and improving the efficiency of chip attachment techniques. His contributions have been instrumental in advancing the capabilities of modern electronics.
Collaborations
Michael has collaborated with notable colleagues, including David Hirsch Danovitch and Carlos Juan Sambucetti. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Michael Liehr's work in semiconductor technology exemplifies the spirit of innovation. His patents and contributions continue to influence the industry, showcasing the importance of advancements in chip attachment methods. His career at IBM highlights his commitment to pushing the boundaries of technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile