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Essex Junction, VT, United States of America

Michael Liehr

USPTO Granted Patents = 6

Average Co-Inventor Count = 5.8

ph-index = 6

Forward Citations = 70(Granted Patents)

Location History:

Yorktown Heights, NY (US) (1989 - 2002)
Essex Junction, VT (US) (2002)
Essex Junction, DE (2003)

Company Filing History:

6 out of 164,108

International Business Machines Corporation

Years Active: 1989-2003

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6 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 6566612 - Method for direct chip attach by solder bumps and an underfill layer (2003-05-20),

2. 6341418 - Method for direct chip attach by solder bumps and an underfill layer (2002-01-29),

3. 6340630 - Method for making interconnect for low temperature chip attachment (2002-01-22),

4. 6127735 - Interconnect for low temperature chip attachment (2000-10-03),

5. 5897336 - Direct chip attach for low alpha emission interconnect system (1999-04-27),

6. 4794863 - Motive structure for transporting workpieces (1989-01-03),

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