The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 1999
Filed:
May. 28, 1997
Guy Paul Brouillette, Quebec, CA;
David Hirsch Danovitch, Quebec, CA;
Michael Liehr, Yorktown Heights, NY (US);
William Thomas Motsiff, Essex Junction, VT (US);
Judith Marie Roldan, Ossining, NY (US);
Carlos Juan Sambucetti, Croton-on-Hudson, NY (US);
Ravi F Saraf, Briarcliff Manor, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.