Michael J Sullivan

Title: Michael J Sullivan: Bringing Innovations to Life through Collaboration

Introduction:

Michael J Sullivan, a highly skilled inventor and researcher based in Red Hook, NY, has made significant contributions to the field of interconnections for flip-chip microelectronic devices. With an impressive portfolio of seven patents, Sullivan has displayed his expertise in developing advanced interconnection structures using lead-free solders and improved reaction barrier layers. This article delves into Sullivan's latest patents, career highlights, and notable collaborations that have propelled his innovative endeavors.

Latest Patents:

Sullivan's latest patents focus on the development of interconnection structures suitable for the flip-chip attachment of microelectronic device chips to packages. The first patent, titled "Interconnections for Flip-Chip Using Lead-Free Solders and Having Improved Reaction Barrier Layers," describes a multi-layer ball-limiting metallurgy that includes an adhesion/reaction barrier layer. This structure ensures effective soldering while maintaining a durable barrier layer after the process. By selectively placing lead-free solder balls on the solder wetting layer, this invention offers enhanced performance and reliability.

Career Highlights:

Throughout his career, Michael J Sullivan has showcased his technical prowess and dedication to innovation. He has served in prominent positions at leading technology companies, including the renowned IBM (International Business Machines Corporation). Working at IBM, Sullivan had access to vast resources and collaborated with industry experts to advance technological frontiers.

Collaborations:

Sullivan's collaborations have been crucial in bringing his ideas to fruition. One notable collaborator is Timothy Martin Reith, whose expertise complements Sullivan's work in interconnections and soldering technologies. Together, they have generated groundbreaking inventions, leveraging their shared knowledge and skills.

Another significant collaborator is Luc Belanger, whose expertise adds depth to Sullivan's innovative projects. Their collaborative efforts have brought forth novel solutions and sparked advancements in interconnection technologies.

Conclusion:

Michael J Sullivan's contributions to the field of interconnections for flip-chip microelectronic devices have been remarkable. With an impressive patent portfolio and extensive collaborations, Sullivan has proven his ability to turn visionary ideas into practical and commercially viable solutions. His dedication to pushing technological boundaries, coupled with his collaborative nature, ensures that his innovations continue to have a lasting impact in the industry.