The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 1986
Filed:
Apr. 12, 1985
David P Fouts, Stanfordville, NY (US);
Devandra Gupta, Ossining, NY (US);
Paul S Ho, Chappaqua, NY (US);
Jasvir S Jaspal, Poughkeepsie, NY (US);
James R Lloyd, Jr, Fishkill, NY (US);
James M Oberschmidt, Poughkeepsie, NY (US);
Kris V Srikrishnan, Wappingers Falls, NY (US);
Michael J Sullivan, Red Hook, NY (US);
IBM Corporation, Armonk, NY (US);
Abstract
Electromigration activity is decreased and lifetime is extended in solder stripes employed as conductors and terminals on microelectronic devices by forming an alloy of a solute element, such as copper, with tin in a lead/tin solder and providing a substantially uniform distribution of particles of the intermetallic compound in the solder. The concentration of the solute element is maintained at less than about three times the tin concentration and less than about 10% of the amount of the solder.