Devandra Gupta

Title: Innovations by Devandra Gupta

Introduction

Devandra Gupta is an accomplished inventor based in Ossining, NY (US). He has made significant contributions to the field of microelectronics, particularly through his innovative patent related to solder alloys.

Latest Patents

Gupta holds a patent titled "Electromigration lifetime increase of lead base alloys." This invention addresses the challenges of electromigration activity in solder stripes used as conductors and terminals on microelectronic devices. By forming an alloy of a solute element, such as copper, with tin in a lead/tin solder, Gupta's invention provides a substantially uniform distribution of particles of the intermetallic compound in the solder. The concentration of the solute element is maintained at less than about three times the tin concentration and less than about 10% of the amount of the solder, effectively decreasing electromigration activity and extending the lifetime of the solder.

Career Highlights

Devandra Gupta is associated with the International Business Machines Corporation (IBM), where he has been able to apply his expertise in materials science and microelectronics. His work has contributed to advancements in the reliability and performance of electronic devices.

Collaborations

Gupta has collaborated with notable colleagues, including David P. Fouts and Paul S. Ho, who have also made significant contributions to the field of microelectronics.

Conclusion

Devandra Gupta's innovative work in solder alloys has the potential to enhance the longevity and reliability of microelectronic devices. His contributions reflect the importance of research and development in advancing technology.