Michael J Bohlinger

Title: Michael J Bohlinger: Innovator in Sensor Technology

Introduction

Michael J Bohlinger is a notable inventor based in Minnetonka, MN (US). He has made significant contributions to the field of sensor technology, holding a total of 9 patents. His innovative approaches have led to advancements in vertical sensor assembly methods and low-height vertical sensor packaging.

Latest Patents

One of his latest patents is the "Vertical Sensor Assembly Method." This method provides a technique to vertically bond a chip to a substrate. It involves forming a metal bar with a linear aspect on the substrate, applying a solder paste layer to create a solder bar, and positioning a plurality of metal pads on the substrate. Each solder pad is strategically offset from the solder bar, allowing for precise alignment of the chip to be bonded. Another significant patent is the "Low Height Vertical Sensor Packaging." This system describes a method for packaging a magnetic sensor, where connection pads are arranged on opposing sides of the sensor die. Bonding wires or flip chip bonding techniques are utilized to connect these pads to the substrate, ensuring efficient assembly and functionality.

Career Highlights

Michael has worked with prominent companies such as Honeywell International Inc. and Honeywell G.m.b.h. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects in sensor technology.

Collaborations

Throughout his career, Michael has collaborated with talented individuals, including Hong Wan and Tamara K Bratland. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Michael J Bohlinger is a distinguished inventor whose work in sensor technology has paved the way for new advancements in the field. His patents reflect his commitment to innovation and excellence in engineering.