The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2010
Filed:
Sep. 02, 2005
Lakshman S. Wathanawasam, Maple Grove, MN (US);
Michael J. Bohlinger, Minnetonka, MN (US);
Tamara K. Bratland, Plymouth, MN (US);
Hong Wan, Plymouth, MN (US);
Lakshman S. Wathanawasam, Maple Grove, MN (US);
Michael J. Bohlinger, Minnetonka, MN (US);
Tamara K. Bratland, Plymouth, MN (US);
Hong Wan, Plymouth, MN (US);
Honeywell International Inc., Morristown, NJ (US);
Abstract
A system and method for packaging a magnetic sensor is described. A sensor die is constructed such that connection pads are situated on two opposing sides of the die in two vertical arrays. Bonding wires connect the connection pads on the sensor die to wire bond pads on a substrate. Alternatively, the connection pads are connected to solderable chip pads on the substrate using flip chip bonding. Traces and vias are used to connect the wire bond pads or the solderable chip pads to sensor package pads. The sensor package pads are located on a single side of a sensor package for mounting on a next assembly. The next assembly has a land pattern that includes at least one leveling pad for positioning the sensor die perpendicular to the next assembly while being mounted and a single row of pads for making connections to the sensor package.