Lakshman S Wathanawasam

Title: **Lakshman S. Wathanawasam: Innovator in Magnetic Sensor Packaging**

Introduction

Lakshman S. Wathanawasam, based in Maple Grove, MN, is a noteworthy inventor recognized for his contributions to the field of magnetic sensor technology. With a focus on innovative packaging solutions, Lakshman holds a patent that enhances the functionality and efficiency of sensor devices.

Latest Patents

Lakshman has one significant patent titled "Low Height Vertical Sensor Packaging." This invention describes a comprehensive system and method for packaging a magnetic sensor. The innovative design features a sensor die where connection pads are located on two opposing sides, arranged in vertical arrays. The bonding wires facilitate connections from the die to the wire bond pads on a substrate. Additionally, the patent outlines alternative methods such as flip chip bonding to connect the pads to solderable chip pads. This streamlined architecture includes traces and vias to link the various pads, promoting efficient assembly processes.

Career Highlights

Lakshman is currently employed at Honeywell International Inc., a global leader in technology and manufacturing. His work at Honeywell focuses on advancing sensor technologies, contributing to the company's reputation for innovation and excellence in engineering.

Collaborations

Throughout his career, Lakshman has collaborated with esteemed colleagues, including Michael J. Bohlinger and Tamara K. Bratland. These collaborations highlight the importance of teamwork in driving innovation and achieving advancements in sensor technology.

Conclusion

Lakshman S. Wathanawasam's contributions to the field of magnetic sensors exemplify the impact of inventive solutions in technology. His patent for low height vertical sensor packaging stands as a testament to his ingenuity and commitment to advancing sensor engineering. As he continues his work at Honeywell, Lakshman's innovations pave the way for new possibilities in sensor applications.