Honeywell International Inc.

Honeywell G.m.b.h.

Michael J Bohlinger

Hong Wan

Tamara K Bratland

William Frank Witcraft

Cheisan J Yue

Ronald James Jensen

Joel J Bodin

Ryan W Rieger

Tangshiun Yeh

Lakshman S Wathanawasam

A method to vertically bond a chip to a substrate is provided. The method includes forming a metal bar having a linear aspect on the substrate, forming a solder paste layer over the metal bar to form a solder bar, forming a plurality of metal pads on the substrate, and forming a solder paste layer over the plurality of metal pads to form a plurality of solder pads on the substrate. Each of the plurality of solder pads is offset from a long edge the solder bar by an offset-spacing. The chip to be vertically bonded to the substrate has a vertical-chip thickness fractionally less than the offset-spacing. The chip to be vertically bonded fits between the plurality of solder pads and the solder bar. The solder bar enables alignment of the chip to be vertically bonded.

Vertical sensor assembly method

A system and method for packaging a magnetic sensor is described. A sensor die is constructed such that connection pads are situated on two opposing sides of the die in two vertical arrays. Bonding wires connect the connection pads on the sensor die to wire bond pads on a substrate. Alternatively, the connection pads are connected to solderable chip pads on the substrate using flip chip bonding. Traces and vias are used to connect the wire bond pads or the solderable chip pads to sensor package pads. The sensor package pads are located on a single side of a sensor package for mounting on a next assembly. The next assembly has a land pattern that includes at least one leveling pad for positioning the sensor die perpendicular to the next assembly while being mounted and a single row of pads for making connections to the sensor package.

Low height vertical sensor packaging

A sensor package comprising an X-axis sensor circuit component, a Y-axis sensor circuit component, and a Z-axis sensor circuit component, each mounted to a top surface of a rigid substrate. To minimize the height of the package, a channel is cut out of the top surface of the substrate in order to accommodate the Z-axis sensor component. On the Z-axis sensor component, input/output (I/O) pads are all arranged in an array along one edge of the sensor to conductively cooperate with I/O pads, or solder-filled vias, on the substrate located at a top edge of the channel. Once the sensors have all been mounted to the substrate, the package is encapsulated, and the overall height is less than 1.2 mm.

Single package design for 3-axis magnetic sensor

Two sensor units are formed from magnetoresistive material. Elements of the first sensor unit have a total anisotropy field in a first direction. Elements of the second sensor unit have a total anisotropy field in a second direction. An integral coil sets a direction of magnetization in the elements of the first and second sensor units. An output of the first sensor unit is representative of magnetic field components perpendicular to the first direction and an output of the second sensor is representative of magnetic field components perpendicular to the second direction.

Magnetic field sensing device

Methods and apparatus for vertical chip-on-board sensor packages can comprise a vertical sensor circuit component comprising a first face, a second face, a bottom edge, a top edge, two side edges, input/output (I/O) pads and at least one sensitive direction wherein the I/O pads are arranged near the bottom edge. Such vertical die chip-on-board sensor packages can also comprise one or more horizontal sensor circuit components comprising a top face, a printed circuit board (PCB) mounting face, a vertical sensor circuit component interface edge, two or more other edges, and one or more sensitive directions wherein the vertical sensor circuit component interface edge supports the vertical sensor circuit component along the Z axis and conductively or non-conductively connects to the vertical sensor circuit component. The methods and apparatus provided include a multi-axis magnetometer for measuring the magnetic field intensity along three orthogonal axes comprising one or more magnetic field sensing circuit components mounted by their PCB mounting face to a PCB and a vertical magnetic sensor circuit component mounted to the PCB such that the vertical magnetic sensor circuit component is attached to and supported by the magnetic field sensing circuit component.

Vertical die chip-on-board

A magnetometer package with a housing, a plurality of sensing elements, a board, and a sealing element. The housing has a first end, a second end, and a bore. The first end of the housing is adapted to receive the board and the sealing element. The second end of the housing is adapted to receive a plug. The plurality of sensing elements, the board, and the sealing element rest in the bore. The plurality of sensing elements are mounted on the board and are orientated so that their sensing axes sense magnetic fields in different directions.

Magnetometer package

A method for manufacturing magnetoresistive sensors whereby a first determination of an anisotropy field of the magnetoresistive material is made and an annealing temperature is selected based on a desired final value of the anisotropy field.

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Minnetonka, MN, United States of America

Michael J Bohlinger