IDiyas

For the Inventor, By the Inventor

Nittendorf/Undorf, Germany

Michael Huber

USPTO Granted Patents = 15 

 

Average Co-Inventor Count = 3.1

ph-index = 12

Forward Citations = 304(Granted Patents)


Location History:

  • Eilsbrunn, DE (2001 - 2002)
  • Nittendorf, DE (1999 - 2015)
  • Nittendorf/Undorf, DE (2000 - 2024)

Company Filing History:

goldMedal8 out of 30,028 
 
Siemens Aktiengesellschaft
 patents
silverMedal7 out of 14,705 
 
Infineon Technologies Ag
 patents

Years Active: 1999-2024

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15 patents (USPTO):
1. 12051640 - Chip card body, method for forming a chip card body and chip card (2024-07-30),
2. 9177181 - Secure epass booklet based on double chip technology (2015-11-03),
3. 6471304 - Brake value signal transmitter for an electrically controlled and activated brake system (2002-10-29),
4. 6384425 - Nonconductive substrate forming a strip or a panel on which a multiplicity of carrier elements is formed (2002-05-07),
5. 6326683 - Carrier element for a semiconductor chip (2001-12-04),
6. 6313524 - Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate (2001-11-06),
7. 6288904 - Chip module, in particular for implantation in a smart card body (2001-09-11),
8. 6253635 - Brake pedal configuration (2001-07-03),
9. 6191951 - Smart card module and smart card including a smart card module (2001-02-20),
10. 6188580 - Smart card and semiconductor chip for use in a smart card (2001-02-13),
11. 6185507 - Microprocessor, in particular for use in a chip card, with a control unit and with a housing surrounding the control unit (2001-02-06),
12. 6088901 - Method for producing a carrier element for semiconductor chips (2000-07-18),
13. 6025997 - Chip module for semiconductor chips having arbitrary footprints (2000-02-15),
14. D406822 - Carrier element for a semiconductor chip for integration into a (1999-03-16),
15. D405779 - Carrier element for a semiconductor chip for integration into a chipcard (1999-02-16),
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