Siemens Aktiengesellschaft

Infineon Technologies Ag

Michael Huber

Peter Stampka

Detlef Houdeau

Josef Heitzer

Frank Pueschner

Jens G Pohl

Juergen Hoegerl

Walther Pachler

Erik Heinemann

Josef Mundigl

J&uuml;rgen Fischer

Gerhard Schraud

Jurgen Fischer

Ulrich Deml

Hans-Georg Mensch

Stephan Schäufele

Richard Scheuenpflug

Helmut Graf

Michael D&ouml;richt

Karl-Heinz Eglseder

Peter Striegel

Volker Rohde

Szabolcs Tompa-Antal

Jochen Damm

A chip card body including a metal plate having at least one slot which defines a current flow path on the metal plate, and having a coupling region to accommodate a chip with an antenna, wherein the coupling region is configured to inductively couple the metal plate to the antenna of the chip, a dielectric layer applied to the metal plate, an electrically conductive layer applied to a side of the dielectric layer opposite the metal plate, and at least one electrically conductive coupling between the metal plate and the electrically conductive layer, wherein the metal plate, the dielectric layer and the electrically conductive layer form a capacitor.

Chip card body, method for forming a chip card body and chip card

A tamper-evident credential has a radio frequency identification (RFID) package with a first antenna and a subordinate antenna, RFID package defining a first part of the credential. The credential also has a subordinate RFID package defining a second part of the credential. The subordinate RFID package selectively coupled to said subordinate antenna so that an interrogation signal applied to said first antenna package is transmitted to the subordinate RFID package across said subordinate antenna.

Secure epass booklet based on double chip technology

A brake value signal transmitter that is to be connected to a brake pedal of a motor vehicle senses activations of the brake pedal with a plurality of sensors and converts them into electrical signals. The brake pedal is connected via a rotatably mounted pressure rod to a piston that can be displaced in the interior of a cylinder. A pressure space that is filled with a gas, has a variable volume, and can be filled at least partially with hydraulic oil is provided in the cylinder. The gas is compressed by the piston when the brake pedal is activated, and in the process increases a reaction force acting on the brake pedal.

Brake value signal transmitter for an electrically controlled and activated brake system

A nonconductive substrate forms a strip or a panel on which a multiplicity of carrier elements is formed, in particular for installation in a chipcard. One side of the substrate is provided with conductive contact surfaces which lie within an outer contour line that determines the size of a carrier element. The other side of the substrate has conductor structures within the outer contour line which form at least contact fields for at least one coil to be contacted and for at least one semiconductor chip. The substrate has cut-outs outside each outer contour line, through which it is possible to access coil terminals of the semiconductor chip for testing purposes from the contact-surface side, as long as the carrier element is still in the strip or in the panel.

Nonconductive substrate forming a strip or a panel on which a multiplicity of carrier elements is formed

A carrier element for a semiconductor chip which can be incorporated in smart cards and soldered onto circuit boards using SMD technology. For this purpose, a copper lamination of a plastic sheet is structured by etching in such a way that contact areas are formed in one piece with conductor tracks which end at the edge of the carrier element and enable reliable soldering.

Carrier element for a semiconductor chip

A chip module has a contact area disposed on its outer side formed of a plurality of essentially flat contact elements of electrically conductive material insulated from one another. At least one semiconductor chip having one or more integrated semiconductor circuits that are electrically connected to the contact elements of the contact area via bonding wires. The contact elements of the chip module are formed by a prefabricated lead frame for supporting the at least one semiconductor chip and have on two opposing sides of the chip module outwardly offset terminals arranged in rows next to one another. The outwardly offset terminals are provided for surface mounting the chip module on the mounting surface of an external printed circuit board or an external circuit board substrate.

Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate

The chip module is particularly suitable for implanting in a smart card body. The module has a carrier and a chip fitted on the carrier. A pedestal or base-type elevation formed on the carrier laterally surrounds the chip completely or partly.

Chip module, in particular for implantation in a smart card body

The brake pedal configuration is particularly suited for an automobile having electrically actuated wheel brakes. A spring provides a resistance force with a nonlinear characteristic against brake actuation forces exerted on the brake pedal. The spring is arcuately curved and is fastened at one end to a support. At is second end the spring is connected to the brake pedal in an articulated manner. At its middle region, the spring is located opposite a stop on which the spring comes to bear after a partial deflection.

Brake pedal configuration

A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.

Smart card module and smart card including a smart card module

The smart card has a card body and a plurality of contact areas exposed on a flat surface of the card body. The contact areas are fabricated from electrically conductive material and are electrically connected to contact terminals, which are assigned to an electronic circuit formed on the semiconductor substrate of a semiconductor chip. The contact areas are fabricated as a structured coating on a main surface of the semiconductor chip. The semiconductor chip, after fabrication with the contact areas is inserted and fixed in a receptacle opening in the card body of the smart card in such a way that the contact areas extend essentially flush with the outer face of the card body. In order to ensure sufficiently high mechanical flexibility, the thickness of the silicon substrate of the chip is preferably less than about 100 &mgr;m.

Smart card and semiconductor chip for use in a smart card

A microprocessor has a control unit with a housing surrounding the control unit. The invention also relates to a chip card having such a microprocessor that is protected against manipulations. At least one sensor indicates ambient states and is connected to the control unit and is provided in a region of the housing of the microprocessor. The control unit is configured in such a way that it can be placed in an inactive state if a measurement signal that indicates a predetermined ambient state is and/or is not fed to the control unit from the sensor.

Microprocessor, in particular for use in a chip card, with a control unit and with a housing surrounding the control unit

A carrier element for a semiconductor chip, in particular to be built into smart cards. The carrier element has a substrate that carries the chip and a stiffening sheet which also carries the chip and has a recess for receiving the chip and its connection leads therein. An edge of the recess is provided with a frame formed integrally from the sheet.

Method for producing a carrier element for semiconductor chips

A chip module has a contact layer made up of several electrically conductive contact elements. The contact elements have a front side with contact areas. A semiconductor chip is disposed above the contact layer. The semiconductor chip has a main area with a number of chip terminals that are electrically connected by means of bonding wires of a maximum mounting length to the back side of the respective contact elements. A thin insulating film of electrically insulating material is disposed between the contact layer and the semiconductor chip. The insulating film is formed with a multiplicity of bonding holes, which are arranged, shaped, numbered, and assigned to respective contact elements of the contact layer in such a way that, with any desired position and footprint of the attached semiconductor chip, an electrical bonding of the chip terminals with a respectively associated contact element of the contact layer is accomplished by means of the bonding wires.

Growing community of inventors

Nittendorf/Undorf, Germany

Michael Huber