The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2000
Filed:
May. 04, 1998
Michael Huber, Nittendorf, DE;
Peter Stampka, Schwandorf, DE;
Siemens Aktiengesellschaft, Munich, DE;
Abstract
A chip module has a contact layer made up of several electrically conductive contact elements. The contact elements have a front side with contact areas. A semiconductor chip is disposed above the contact layer. The semiconductor chip has a main area with a number of chip terminals that are electrically connected by means of bonding wires of a maximum mounting length to the back side of the respective contact elements. A thin insulating film of electrically insulating material is disposed between the contact layer and the semiconductor chip. The insulating film is formed with a multiplicity of bonding holes, which are arranged, shaped, numbered, and assigned to respective contact elements of the contact layer in such a way that, with any desired position and footprint of the attached semiconductor chip, an electrical bonding of the chip terminals with a respectively associated contact element of the contact layer is accomplished by means of the bonding wires.