The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2002
Filed:
Aug. 20, 1998
Michael Huber, Nittendorf/Undorf, DE;
Peter Stampka, Schwandorf-Klardorf, DE;
Gerhard Schraud, Mering, DE;
Peter Striegel, München, DE;
Hans-Georg Mensch, Neunburg, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A nonconductive substrate forms a strip or a panel on which a multiplicity of carrier elements is formed, in particular for installation in a chipcard. One side of the substrate is provided with conductive contact surfaces which lie within an outer contour line that determines the size of a carrier element. The other side of the substrate has conductor structures within the outer contour line which form at least contact fields for at least one coil to be contacted and for at least one semiconductor chip. The substrate has cut-outs outside each outer contour line, through which it is possible to access coil terminals of the semiconductor chip for testing purposes from the contact-surface side, as long as the carrier element is still in the strip or in the panel.