Phoenix, AZ, United States of America

Michael D Smigel


Average Co-Inventor Count = 4.9

ph-index = 3

Forward Citations = 27(Granted Patents)


Company Filing History:


Years Active: 2003-2008

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4 patents (USPTO):

Title: Michael D Smigel: Innovator in Wafer Processing Technology

Introduction

Michael D Smigel is a notable inventor based in Phoenix, AZ, with a focus on innovations in wafer processing technology. He holds a total of 4 patents that contribute significantly to the field. His work has been instrumental in developing mechanisms that enhance the efficiency of loading and unloading processes in semiconductor manufacturing.

Latest Patents

Among his latest patents is the CMP apparatus and load cup mechanism. This invention provides a load cup mechanism designed for loading and unloading workpieces in a Chemical Mechanical Planarization (CMP) apparatus. The mechanism features a load cup arm that pivots between a load position and an off-load position, ensuring precise handling of workpieces. Additionally, he has developed a workpiece handling end-effector that allows for efficient loading and unloading of wafers into processing apparatuses. This two-sided end-effector utilizes rotatable catch mechanisms to securely grasp wafers, facilitating their movement into the processing environment.

Career Highlights

Throughout his career, Michael has worked with prominent companies in the semiconductor industry, including Speedfam-Ipec Corporation and Novellus Systems Incorporated. His contributions to these organizations have helped advance the technology used in wafer processing.

Collaborations

Michael has collaborated with several professionals in his field, including Ann Wilkey and Randy McNurlin. These partnerships have fostered innovation and development in the technologies he has worked on.

Conclusion

Michael D Smigel's contributions to wafer processing technology through his patents and collaborations highlight his role as a significant inventor in the industry. His work continues to influence advancements in semiconductor manufacturing processes.

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