Miao-Pei Chen

Title: Innovations by Miao-Pei Chen

Introduction

Miao-Pei Chen is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of wafer processing technology. With a total of 3 patents to his name, Chen's work focuses on improving the efficiency and accuracy of wafer defect inspection and processing.

Latest Patents

Chen's latest patents include a "Wafer Surface Defect Inspection Method and Apparatus Thereof." This invention provides a method for inspecting wafer surfaces by receiving scanning information that includes multiple parameters. The method determines reference points and generates path information to create a curve chart, which is then used to identify defects and their types. Another significant patent is the "Wafer Processing System and Rework Method Thereof." This system utilizes an image capture device to detect defect patterns in captured images, calculates target removal thickness based on contrast values, and controls processing devices accordingly.

Career Highlights

Miao-Pei Chen is currently employed at GlobalWafers Co., Ltd., where he continues to innovate in wafer technology. His work has been instrumental in advancing the capabilities of wafer processing systems, making them more reliable and efficient.

Collaborations

Chen collaborates with talented coworkers, including Shang-Chi Wang and Han-Zong Wu, who contribute to the innovative environment at GlobalWafers Co., Ltd.

Conclusion

Miao-Pei Chen's contributions to wafer technology through his patents demonstrate his commitment to innovation in the field. His work not only enhances the efficiency of wafer processing but also sets a standard for future advancements.