The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Jan. 06, 2022
Applicant:
Globalwafers Co., Ltd., Hsinchu, TW;
Inventors:
Shang-Chi Wang, Hsinchu, TW;
Cheng-Jui Yang, Hsinchu, TW;
Miao-Pei Chen, Hsinchu, TW;
Han-Zong Wu, Hsinchu, TW;
Assignee:
GlobalWafers Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); H01L 29/1608 (2013.01);
Abstract
A wafer processing system and a rework method thereof are provided. An image capture device captures an image of a wafer to generate a captured image. A control device detects a defect pattern in the captured image, calculates a target removal thickness according to distribution of contrast values of the defect pattern, and controls a processing device to perform processing on the wafer according to the target removal thickness.