Company Filing History:
Years Active: 2009-2014
Title: Innovations of Mengzhi Pang
Introduction
Mengzhi Pang is a notable inventor based in Phoenix, AZ. He has made significant contributions to the field of microelectronics, particularly in the development of advanced solder materials. With a total of 9 patents to his name, Pang's work has had a substantial impact on electronic assembly technologies.
Latest Patents
Among his latest patents is a groundbreaking invention titled "Solder joints with enhanced electromigration resistance." This patent describes electronic assemblies and solders used in these assemblies. One embodiment includes a die and a substrate, with a solder material positioned between them. The solder comprises at least 91 weight percent Sn, 0.4 to 1.0 weight percent Cu, and at least one dopant selected from the group consisting of Ag, Bi, P, and Co. Another significant patent is "Doping of lead-free solder alloys and structures formed thereby." This patent outlines methods of forming a microelectronic structure by doping a lead-free solder material with nickel, which comprises up to about 0.2 percent by weight of the solder material, and then applying it to a substrate with a copper pad.
Career Highlights
Mengzhi Pang is currently employed at Intel Corporation, where he continues to innovate in the field of electronic materials. His work at Intel has positioned him as a key player in advancing solder technology, which is crucial for the reliability of electronic devices.
Collaborations
Pang has collaborated with several talented individuals in his field, including Charan K Gurumurthy and John Stephen Guzek. These collaborations have further enhanced the quality and impact of his inventions.
Conclusion
Mengzhi Pang's contributions to solder technology and microelectronics are noteworthy. His innovative patents and work at Intel Corporation demonstrate his commitment to advancing the field. His ongoing efforts will likely continue to shape the future of electronic assembly technologies.