The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Aug. 08, 2011
Applicants:
Mengzhi Pang, Phoenix, AZ (US);
Pilin Liu, Chandler, AZ (US);
Charavanakumara Gurumurthy, Higley, AZ (US);
Inventors:
Mengzhi Pang, Phoenix, AZ (US);
Pilin Liu, Chandler, AZ (US);
Charavanakumara Gurumurthy, Higley, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/488 (2006.01); B23K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate, the solder comprising at least 91 weight percent Sn, 0.4 to 1.0 weight percent Cu and at least one dopant selected from the group consisting of Ag, Bi, P, and Co. Other embodiments are described and claimed.