Pilin Liu

Title: Pilin Liu: Innovator in Electronics Packaging

Introduction

Pilin Liu is a notable inventor based in Chandler, AZ, who has made significant contributions to the field of electronics packaging. With a total of 4 patents to his name, Liu has focused on developing innovative solutions that enhance the performance and efficiency of electronic assemblies.

Latest Patents

Liu's latest patents include groundbreaking technologies such as the "Interposer package-on-package (PoP) with solder array thermal contacts." This invention involves an electronics package that features a first package substrate, which includes a die embedded in a mold layer, a thermal interface pad over the die, and a plurality of solder balls. The design ensures that the thermal interface pad and solder balls are electrically isolated from the circuitry of the electronics package. Another significant patent is related to "Electronic assembly using bismuth-rich solder." This technology describes an electronic assembly that incorporates a first substrate with a copper pad and a second substrate with a copper redistribution layer, utilizing bismuth-rich solder for enhanced electrical engagement.

Career Highlights

Pilin Liu is currently employed at Intel Corporation, where he continues to push the boundaries of innovation in electronics. His work has been instrumental in developing advanced packaging solutions that cater to the evolving needs of the electronics industry.

Collaborations

Throughout his career, Liu has collaborated with talented individuals such as Mengzhi Pang and Charavanakumara Gurumurthy. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Pilin Liu's contributions to electronics packaging through his patents and work at Intel Corporation highlight his role as a key innovator in the field. His inventions not only advance technology but also pave the way for future developments in electronic assembly.