The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Jun. 05, 2007
Mengzhi Pang, Phoenix, AZ (US);
Yonggang LI, Chandler, AZ (US);
Mengzhi Pang, Phoenix, AZ (US);
Yonggang Li, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A microelectronic package substrate and an electrically conductive pin. The substrates includes: a die-side surface adapted to receive a die thereon; a printed circuit board (PCB)-side surface adapted to be mechanically and electrically bonded to a PCB; an array of land pads on the PCB-side surface, the land pads defining anchoring recesses therein; an array of electrically conductive pins electrically and mechanically bonded to respective ones of the land pads, the pins having anchoring elements thereon mated with corresponding ones of the anchoring recesses of the land pads, the anchoring elements and anchoring recesses being configured such that a mating thereof inhibits a tilting of the pins on the land pads; and a plurality of pin-attach solder joints mechanically and electrically bonding the pins to corresponding ones of the land pads.