Meng-Huan Chia

Title: Meng-Huan Chia: Innovator in Electronic Packaging Technology

Introduction

Meng-Huan Chia is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of nine patents. His innovative work focuses on enhancing the efficiency and performance of electronic components.

Latest Patents

One of his latest patents is titled "Electronic package and manufacturing method thereof." This invention provides an electronic package where a first electronic element and a second electronic element are strategically placed on different sides of a circuit structure. A first metal layer is formed between the first side of the circuit structure and the first electronic element, while a second metal layer is formed on the surface of the second electronic element. The design includes thermally conductive pillars that extend into the circuit structure, allowing for efficient heat dissipation during the operation of the electronic elements. This innovation prevents heat accumulation, ensuring optimal performance.

Another notable patent is the "Method of fabricating a substrate with metal reflection layer." In this patent, a first and second patterned circuit layer are created on both surfaces of a base material. A first adhesive layer is applied to the first patterned circuit layer, with a metal reflection layer covering the first insulation layer. The reflectance of this layer is greater than or equal to 85%, and it is designed without conductive material between the first patterned circuit layer and the metal reflection layer. The protection layer comprises a transparent polymer, ensuring a light transmittance of greater than or equal to 80%.

Career Highlights

Meng-Huan Chia has worked with notable companies such as Uniflex Technology Inc. and Siliconware Precision Industries Co., Ltd. His experience in these organizations has contributed to his expertise in electronic packaging technologies.

Collaborations

He has collaborated with talented individuals in the field, including Yi-Chun Liu and Yuan-Chih Lee. These partnerships have fostered innovation and development in his projects.

Conclusion

Meng-Huan Chia is a distinguished inventor whose work in electronic packaging has led to significant advancements in the industry. His patents reflect a commitment to improving electronic component efficiency and performance.