The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Sep. 01, 2021
Uniflex Technology Inc., Taichung, TW;
Cheng-I Tu, Tainan, TW;
Ying-Hsing Chen, Taichung, TW;
Meng-Huan Chia, Taichung, TW;
Hsin-Ching Su, Miaoli County, TW;
Yi-Chun Liu, New Taipei, TW;
Cheng-Chung Lai, Changhua County, TW;
Yuan-Chih Lee, Taoyuan, TW;
UNIFLEX Technology Inc., Taichung, TW;
Abstract
A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.