The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2024

Filed:

Aug. 19, 2021
Applicant:

Uniflex Technology Inc., Taichung, TW;

Inventors:

Cheng-I Tu, Tainan, TW;

Ying-Hsing Chen, Taichung, TW;

Meng-Huan Chia, Taichung, TW;

Hsin-Ching Su, Miaoli County, TW;

Yi-Chun Liu, New Taipei, TW;

Cheng-Chung Lai, Changhua County, TW;

Yuan-Chih Lee, Taoyuan, TW;

Assignee:

UNIFLEX Technology Inc., Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H05K 1/05 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); H01L 21/02496 (2013.01); H01L 21/76846 (2013.01); H01L 24/83 (2013.01); H05K 1/056 (2013.01); H05K 1/115 (2013.01); H05K 3/28 (2013.01); H05K 3/384 (2013.01); H05K 3/46 (2013.01); H05K 3/4605 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01); H05K 1/0313 (2013.01); H05K 3/4602 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01);
Abstract

A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.


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