East Palo Alto, CA, United States of America

Melissa Wette


Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Melissa Wette

Introduction

Melissa Wette is a notable inventor based in East Palo Alto, California. She has made significant contributions to the field of semiconductor packaging. Her work focuses on enhancing the efficiency and functionality of electronic components.

Latest Patents

Melissa Wette holds a patent for the "Selective deposition of embedded thin-film resistors for semiconductor packaging." This invention includes package substrates and a method for forming these substrates. The package substrate features a dielectric with a cavity that has a specific footprint, an embedded resistor, and multiple traces on the resistor. The design allows for activated surfaces and tapered sidewalls, enhancing the performance of the resistor. The dielectric may also contain metallization particles or ions, while the resistor can be made from resistive materials such as nickel-phosphorus (NiP), aluminum-nitride (AlN), and titanium-nitride (TiN). Additionally, the package substrate may include a first resistor that is embedded adjacent to the primary resistor, allowing for different resistance values.

Career Highlights

Melissa Wette is currently employed at Intel Corporation, where she continues to innovate in the semiconductor industry. Her work has been instrumental in advancing technologies that improve electronic device performance.

Collaborations

Melissa collaborates with talented colleagues, including Brandon C Marin and Frank Truong, who contribute to her projects and enhance the innovation process.

Conclusion

Melissa Wette's contributions to semiconductor packaging through her innovative patent demonstrate her expertise and commitment to advancing technology. Her work at Intel Corporation and collaborations with fellow professionals highlight her significant role in the industry.

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