Intel Corporation

Melissa Wette

Srinivas V Pietambaram

Brandon C Marin

Yonggang Li

Dilan Seneviratne

Frank Truong

Darko Grujicic

Sameer Paital

Rengarajan Shanmugam

Shivasubramanian Balasubramanian

Embodiments include package substrates and a method of forming the package substrates. A package substrate includes a dielectric having a cavity that has a footprint, a resistor embedded in the cavity of the dielectric, and a plurality of traces on the resistor, where a plurality of surfaces of the resistor are activated surfaces. The resistor may also have a plurality of sidewalls which may be activated sidewalls and tapered. The dielectric may include metallization particles/ions. The resistor may include resistive materials, such as nickel-phosphorus (NiP), aluminum-nitride (AlN), and/or titanium-nitride (TiN). The package substrate may further include a first resistor embedded adjacently to the resistor. The first resistor may have a first footprint of a first cavity that is different than the footprint of the cavity of the resistor. The resistor may have a resistance value that is thus different than a first resistance value of the first resistor.

Selective deposition of embedded thin-film resistors for semiconductor packaging

Growing community of inventors

East Palo Alto, CA, United States of America

Melissa Wette