Company Filing History:
Years Active: 2018-2021
Title: Meiyu Piao: Innovator in Wafer Processing Technology
Introduction
Meiyu Piao is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of wafer processing, holding a total of 5 patents. Her innovative methods have advanced the technology used in semiconductor manufacturing.
Latest Patents
Among her latest patents, Meiyu Piao has developed a wafer processing method that includes several critical steps. The process begins with forming a mask on the back side of a wafer that includes a device layer. This mask is used to create grooves in the substrate along streets from the back side of the wafer. Plasma etching is then applied from the back side through the mask to form these grooves and define chip regions surrounded by them. Following the etching step, the wafer is immersed in water with ultrasonic vibrations applied, which causes the device layer to crack or rupture along the outer peripheral edges of the chip regions. Finally, a tape is bonded to the front side of the wafer before the water immersion step. Another patent describes a similar wafer processing method, which includes ejecting high-pressure fluid against the back side of the wafer while it is mounted on a surface, pressing the wafer at regions surrounded by the etched grooves.
Career Highlights
Meiyu Piao has worked with notable companies in the semiconductor industry, including Disco Corporation. Her experience in these organizations has allowed her to refine her skills and contribute to groundbreaking technologies in wafer processing.
Collaborations
Throughout her career, Meiyu has collaborated with talented individuals such as Kentaro Odanaka and Masatoshi Wakahara. These collaborations have further enriched her work and led to innovative advancements in her field.
Conclusion
Meiyu Piao's contributions to wafer processing technology exemplify her dedication to innovation and excellence. Her patents reflect her expertise and commitment to advancing semiconductor manufacturing processes.