Mezzago, Italy

Matteo De Santa

This inventor holds 7 USPTO granted patents and 5 published patent applications and 2 EPO patents. Top assignee: Stmicroelectronics S.r.l.. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Matteo De Santa. Retrieved from https://idiyas.com/inventor/matteo-de-santa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.3

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Mezzago, IT (2018 - 2020)
  • Lombardia, IT (2024)

Company Filing History:


Years Active: 2018-2026

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7 patents (USPTO):Explore Patents

Title: Matteo De Santa: Innovator in Semiconductor Technology

Introduction

Matteo De Santa is a prominent inventor based in Mezzago, Italy, known for his significant contributions to the field of semiconductor technology. With a total of five patents to his name, he has made remarkable advancements that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Among his latest patents is a method of manufacturing semiconductor devices and the corresponding semiconductor device. This innovation involves arranging a semiconductor chip over a substrate in the form of a leadframe. A set of current-carrying formations, configured as conductive ribbons, are coupled to the semiconductor chip. Notably, the substrate does not include electrically conductive formations for electrically coupling the conductive ribbons to each other. Electrical contacts are formed via wedge bonding between adjacent conductive ribbons, providing a contact that supports a multi-formation current-carrying channel. Another significant patent is a method of manufacturing semiconductor products, which includes a corresponding substrate, semiconductor product, and tool. This method provides electrical wire-like connections between at least one semiconductor die arranged on a semiconductor die mounting area of a substrate and an array of electrically-conductive leads in the substrate. During the bonding of wire-like connections to the electrically-conductive leads, a pressure force is applied to the leads via a pair of mutually co-operating force transmitting surfaces, enhancing the reliability of the connections.

Career Highlights

Matteo De Santa is currently employed at STMicroelectronics S.r.l., a leading company in semiconductor solutions. His work at STMicroelectronics has allowed him to focus on innovative technologies that push the boundaries of semiconductor manufacturing.

Collaborations

Throughout his career, Matteo has collaborated with notable colleagues, including Mauro Mazzola and Battista Vitali. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Matteo De Santa's contributions to semiconductor technology through his patents and work at STMicroelectronics highlight his role as a key innovator in the field. His advancements not only improve semiconductor manufacturing processes but also pave the way for future innovations in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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