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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10141197 B1

PDFFull Text
Date of Patent:
Nov. 27, 2018

Filed:

Mar. 30, 2016

Thermosonically bonded connection for flip chip packages

Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Mauro Mazzola, Calvenzano, IT;

Battista Vitali, Romano Di Lombardia, IT;

Matteo De Santa, Mezzago, IT;

Assignee:

STMICROELECTRONICS S.R.L., Agrate Brianza, IT;

Attorney:

Seed IP Law Group LLP

Primary Examiner:

Brian Turner

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 29/40 (2006.01); H01L 23/02 (2006.01); H01L 23/52 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/482 (2006.01); H01L 23/492 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4828 (2013.01); H01L 21/4825 (2013.01); H01L 21/4875 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/3171 (2013.01); H01L 23/4822 (2013.01); H01L 23/4924 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/97 (2013.01); H01L 2924/181 (2013.01);
Abstract

A method of making a package is disclosed. The method may include forming bond pads on a first surface of a substrate, forming leads in the substrate by etching recesses in a second surface of the substrate, the second surface being opposite the first surface, and plating at least a portion of a top surface of the leads with a layer of finish plating. The method may also include thermosonically bonding the leads to a die by thermosonically bonding the finish plating to the die and encapsulating the die and the leads in an encapsulant.

Find Patent Forward Citations

Mazzola, Mauro. (2018). Thermosonically bonded connection for flip chip packages (U.S. Patent No. 10141197). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10141197

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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