Stmicroelectronics S.r.l.

Matteo De Santa

Mauro Mazzola

Battista Vitali

Riccardo Villa

Mirko Alesi

A leadframe includes a die pad having arranged thereon a first semiconductor die with an electrically conductive ribbon extending on the first semiconductor die. The first semiconductor die lies intermediate the leadframe and the electrically conductive ribbon. A second semiconductor die is mounted on the electrically conductive ribbon to provide, on the same die pad, a stacked arrangement of the second semiconductor die and the first semiconductor die with the at least one electrically conductive ribbon intermediate the first semiconductor die and the second semiconductor die. Package size reduction can thus be achieved without appreciably affecting the assembly flow of the device.

Method of assembling semiconductor devices and corresponding semiconductor device

A semiconductor chip is arranged over a substrate in the form of a leadframe. A set of current-carrying formations configured as conductive ribbons are coupled to the semiconductor chip. The substrate does not include electrically conductive formations for electrically coupling the conductive ribbons to each other. Electrical contacts are formed via wedge bonding, for instance, between adjacent ones of the conductive ribbons so that a contact is provided between the adjacent ones of the conductive ribbons in support of a multi-formation current-carrying channel.

Method of manufacturing semiconductor devices and corresponding semiconductor device

In providing electrical wire-like connections between at least one semiconductor die arranged on a semiconductor die mounting area of a substrate and an array of electrically-conductive leads in the substrate, pressure force is applied to the electrically-conductive leads in the substrate during bonding the wire-like connections to the electrically-conductive leads. Such a pressure force is applied to the electrically-conductive leads in the substrate via a pair of mutually co-operating force transmitting surfaces. These surfaces include a first convex surface engaging a second concave surface.

Method of manufacturing semiconductor products, corresponding substrate, semiconductor product and tool

A process for manufacturing a semiconductor flip chip package and a corresponding flip chip package. The process comprises associating conducting bump pads to a face corresponding to an active side of one or more electronic dice, flipping the one or more electronic dice so that said face corresponding to an active side of one or more electronic dies is facing a leadframe carrying contacting pads in correspondence of said conducting bump pads, bonding said contacting pads to said conducting bump pads and encasing said one or more electronic dice in a casing by a molding operation. The process includes providing a leadframe having contacting pads presenting a recessed surface in correspondence of the position of said conducting bump pads.

Process for manufacturing a flip chip semiconductor package and a corresponding flip chip package

A method of making a package is disclosed. The method may include forming bond pads on a first surface of a substrate, forming leads in the substrate by etching recesses in a second surface of the substrate, the second surface being opposite the first surface, and plating at least a portion of a top surface of the leads with a layer of finish plating. The method may also include thermosonically bonding the leads to a die by thermosonically bonding the finish plating to the die and encapsulating the die and the leads in an encapsulant.

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Mezzago, Italy

Matteo De Santa