The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Oct. 04, 2022
Applicant:
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventors:
Matteo De Santa, Agrate Brianza, IT;
Mauro Mazzola, Calvenzano, IT;
Assignee:
STMicroelectronics S.r.l., Agrate Brianza, IT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 24/84 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/3142 (2013.01); H01L 23/49575 (2013.01); H01L 23/5386 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H01L 25/072 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/84031 (2013.01); H01L 2224/84039 (2013.01); H01L 2224/84047 (2013.01); H01L 2224/84205 (2013.01); H01L 2224/84931 (2013.01); H01L 2224/84939 (2013.01); H01L 2224/84947 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor die and an electrically conductive ribbon are arranged on a substrate. The electrically conductive ribbon includes a roughened surface. An insulating encapsulation is molded onto the semiconductor die and the electrically conductive ribbon. The roughened surface of the electrically conductive ribbon provides a roughened coupling interface to the insulating encapsulation.
De Santa, Matteo. (2026). Roughened surface of a conductive wedge bonded ribbon encapsulated in a sermiconductor package (U.S. Patent No. 12575468). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12575468
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile