Masayuki Osada is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of (meth)acrylic resin compositions and conductive adhesives. With a total of five patents to his name, Osada's work has had a considerable impact on various industrial applications.

Latest Patents

Osada's latest patents include a (meth)acrylic resin composition and a thermosetting conductive adhesive. The (meth)acrylic resin composition is designed to achieve both storage stability at 25°C and low-temperature curability between 60 to 140°C when used in a sealed container. This innovative composition includes a urethane modified oligomer, a hydroxyl and/or carboxylic group monomer, and a specific organic peroxide. Additionally, his thermosetting conductive adhesive exhibits high conductivity and excellent adhesive strength when cured at high temperatures in a short time. This adhesive comprises a urethane-modified polyfunctional (meth)acrylate oligomer, a monofunctional (meth)acrylate monomer, an organic peroxide, and conductive particles.

Career Highlights

Osada is currently employed at Threebond Co., Ltd., where he continues to advance his research and development efforts. His work has been instrumental in enhancing the performance of adhesives and resin compositions used in various applications.

Collaborations

Osada collaborates with notable colleagues, including Soichi Ota and Hitoshi Mafune. Their combined expertise contributes to the innovative projects at Threebond Co., Ltd.

Conclusion

Masayuki Osada's contributions to the field of (meth)acrylic resin compositions and conductive adhesives highlight his role as a leading inventor in materials science. His innovative patents continue to influence industrial applications and pave the way for future advancements.

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