The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Jul. 28, 2017
Applicant:
Threebond Co., Ltd., Tokyo, JP;
Inventors:
Soichi Ota, Tokyo, JP;
Takashi Suzuki, Tokyo, JP;
Makoto Kato, Tokyo, JP;
Hitoshi Mafune, Tokyo, JP;
Masayuki Osada, Tokyo, JP;
Assignee:
THREEBOND CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09J 9/02 (2006.01); C08G 59/40 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08G 59/40 (2013.01); C08L 63/00 (2013.01); C09J 9/02 (2013.01);
Abstract
An epoxy resin composition which exhibits excellent storage stability while having a low initial viscosity and favorable low temperature curability and an electro-conductive adhesive containing the same. An epoxy resin composition includes components (A) to (C): component (A): an epoxy resin (excluding the following component (B)); component (B): an epoxy resin having one epoxy group in a molecule and a surface tension of from 28.5 to 35.0 mN/m; and component (C): a latent curing agent.