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Threebond Co., Ltd.

Calculating rank

USPTO Granted Patents = 154

% Expired Patents = 4.5

CIPO Patents = 5

EPO Patents = 26

Trademarks = 2

Forward Citations = 849

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172 inventors (with patents filed for the assignee):

Tetsunori Soga (11 out of 13 patents)

Ikuzo Usami (11 out of 13 patents)

Hitoshi Mafune (8 out of 8 patents)

4. Hiroyuki Mikuni (8 out of 9 patents)

5. Takashi Nemoto (7 out of 23 patents)

6. Yoshihide Arai (7 out of 7 patents)

7. Soichi Ota (6 out of 6 patents)

8. Makoto Kato (6 out of 24 patents)

9. Vincent Daniel McGinniss (6 out of 61 patents)

10. Nobuhiro Katsuno (6 out of 6 patents)

11. Masayuki Osada (5 out of 5 patents)

12. Kenichi Horie (5 out of 21 patents)

13. Kazuyuki Ueno (5 out of 5 patents)

14. Yoshinori Sato (5 out of 6 patents)

15. Toru Takeoka (5 out of 5 patents)

Core Competencies:

Photocurable Resin

Sealing Method

Fuel Cell

Adhesive Composition

Cured Product

Cleaning Composition

Conductive Resin

Curable Coating

Nail Coating

Thermally Conductive

Laminated Body

Moisture Curable

154 patents: Sort by Forward Citations

1. 12516189 - Curable resin composition, production method thereof and cured product (2026-01-06),

2. 12508219 - Photocurable resin composition for nails or artificial nails, cured product, and method for coating nails or artificial nails (2025-12-30),

3. 12497477 - Photocurable composition, sealing agent, and cured product (2025-12-16),

4. 12460073 - Curable resin composition, fuel cell, and sealing method (2025-11-04),

5. 12404388 - Resin composition (2025-09-02),

6. 12344689 - Sheet-shaped photocurable composition, photocurable composition solution, method for producing sheet-shaped photocurable composition, and laminated body (2025-07-01),

7. 12331269 - Cleaning composition, aerosol, cleaning sprayer, and cleaning method (2025-06-17),

8. 12331228 - Photocurable resin composition, cured product, and laminated body (2025-06-17),

9. 12325811 - Radical-polymerizable adhesive composition for laminating and bonding steel plates, adhesive laminate, motor, and method for manufacturing adhesive laminate (2025-06-10),

10. 12104077 - Curable coating agent composition and cured coating film (2024-10-01),

11. 12104060 - Conductive resin composition (2024-10-01),

12. 12076744 - Assembly, method for using assembly, applying device, method for using applying device, method for replenishing material (2024-09-03),

13. 12065528 - Photocurable composition (2024-08-20),

14. 12041740 - Waterproof case for automobile components (2024-07-16),

15. 12012509 - Photocurable composition and cured material thereof (2024-06-18),

Company Overview

Threebond Co., Ltd., headquartered in Tokyo, specializes in the development and manufacturing of photocurable resin compositions. The company focuses on innovative solutions in various technological fields, including adhesives, sealing methods, and conductive resins. Its expertise extends to applications in fuel cells and curable coatings, catering to diverse industries. Threebond is committed to advancing materials technology, providing high-performance products that meet the evolving needs of its global clientele.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

154 Patents

#417 in Tokyo

#841 in Japan

#5,327 in the World

Threebond Co., Ltd.

Forward Citations = 849

172 inventors:

Tetsunori Soga (11 out of 13 patents)

Ikuzo Usami (11 out of 13 patents)

Hitoshi Mafune (8 out of 8 patents)

4. Hiroyuki Mikuni (8 out of 9 patents)

5. Takashi Nemoto (7 out of 23 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Threebond Co., Ltd.. Retrieved from https://idiyas.com/company/threebond-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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