logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11505692 B1

PDFFull Text
Date of Patent:
Nov. 22, 2022

Filed:

Aug. 24, 2017

(meth) acrylic resin composition and electroconductive adhesive using the same

Applicant:

Threebond Co., Ltd., Tokyo, JP;

Inventors:

Soichi Ota, Tokyo, JP;

Yusuke Kuwahara, Tokyo, JP;

Hitoshi Mafune, Tokyo, JP;

Tomoya Kodama, Tokyo, JP;

Makoto Kato, Tokyo, JP;

Masayuki Osada, Tokyo, JP;

Assignee:

THREEBOND CO., LTD., Tokyo, JP;

Attorney:

Maier & Maier, PLLC

Primary Examiner:

Katie L Hammer

Int. Cl.
CPC ...
C08L 33/10 (2006.01); C09J 9/02 (2006.01); C08F 4/34 (2006.01); H01B 1/22 (2006.01); C08F 290/06 (2006.01); C08L 51/00 (2006.01); C08F 220/36 (2006.01); C09J 151/08 (2006.01); C08F 2/44 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C08F 20/28 (2006.01); C08K 3/08 (2006.01); C08K 5/14 (2006.01); C08K 9/04 (2006.01); C09J 133/10 (2006.01); C08K 5/09 (2006.01);
U.S. Cl.
CPC ...
C08L 33/10 (2013.01); C08F 2/44 (2013.01); C08F 4/34 (2013.01); C08F 20/28 (2013.01); C08F 220/36 (2013.01); C08F 290/06 (2013.01); C08F 290/067 (2013.01); C08K 3/08 (2013.01); C08K 5/14 (2013.01); C08K 9/04 (2013.01); C08L 51/00 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 133/10 (2013.01); C09J 151/08 (2013.01); H01B 1/22 (2013.01); C08K 5/09 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/001 (2013.01); C08K 2201/003 (2013.01); C08K 2201/005 (2013.01); C08K 2201/006 (2013.01);
Abstract

In the (meth)acrylic resin composition of the present invention, when a sealed container is used, it is possible to achieve both storage stability in an atmosphere at 25° C. and low temperature curability in an atmosphere at 60 to 140° C., and further, properties thereof can be exhibited even in an electroconductive adhesive including electroconductive particles. The present invention is a (meth)acrylic resin composition including the following components (A) to (C): component (A): a urethane modified oligomer having a (meth)acrylic group, component (B): a monomer having a hydroxyl group and/or a carboxylic group and one (meth)acrylic group in a molecule in which a surface tension is 25 to 45 mN/m, and component (C): an organic peroxide having a specific structure.

Find Patent Forward Citations

Loading…