Company Filing History:
Years Active: 2021-2022
Title: Innovations by Tomoya Kodama
Introduction
Tomoya Kodama is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced resin compositions and adhesives. With a total of 3 patents, his work has garnered attention for its innovative approaches to enhancing material properties.
Latest Patents
Kodama's latest patents include a (meth)acrylic resin composition and a thermocurable electroconductive adhesive. The (meth)acrylic resin composition is designed to achieve both storage stability at 25°C and low-temperature curability between 60 to 140°C when used in a sealed container. This composition includes a urethane modified oligomer with a (meth)acrylic group, a monomer with a hydroxyl and/or carboxylic group, and an organic peroxide with a specific structure.
The thermocurable electroconductive adhesive addresses the challenge of improving conductivity without the need for excessive electroconductive particles, which can increase viscosity and compromise preservation stability. This adhesive comprises an oligomer with a (meth)acryl group, a monomer with a methacryl group, an organic peroxide, and surface-treated electroconductive particles.
Career Highlights
Kodama is currently employed at Threebond Co., Ltd., where he continues to innovate in the field of adhesive technologies. His work has been instrumental in developing products that meet the demands of modern applications, particularly in electronics and materials engineering.
Collaborations
Some of his notable coworkers include Soichi Ota and Hitoshi Mafune, who have collaborated with him on various projects within the company.
Conclusion
Tomoya Kodama's contributions to the field of materials science through his innovative patents reflect his commitment to advancing technology. His work continues to influence the development of new materials and applications in various industries.