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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10982120 B1

PDFFull Text
Date of Patent:
Apr. 20, 2021

Filed:

Aug. 17, 2017

Thermocurable electroconductive adhesive

Applicant:

Threebond Co., Ltd., Tokyo, JP;

Inventors:

Soichi Ota, Tokyo, JP;

Hitoshi Mafune, Tokyo, JP;

Makoto Kato, Tokyo, JP;

Tomoya Kodama, Tokyo, JP;

Assignee:

THREEBOND CO., LTD., Tokyo, JP;

Attorney:

Maier & Maier, PLLC

Primary Examiner:

Khanh T Nguyen

Int. Cl.
CPC ...
H01B 1/22 (2006.01); H01B 1/20 (2006.01); C09J 9/02 (2006.01); C09J 201/00 (2006.01); C09J 11/02 (2006.01); C09J 163/00 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 163/10 (2006.01); C08K 3/08 (2006.01); C08K 9/04 (2006.01); C08K 5/14 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 11/02 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 163/00 (2013.01); C09J 163/10 (2013.01); C09J 201/00 (2013.01); H01B 1/20 (2013.01); H01B 1/22 (2013.01); C08K 5/0091 (2013.01); C08K 5/14 (2013.01); C08K 9/04 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/001 (2013.01);
Abstract

Conventionally, when an adherend is nickel or the like, it has been difficult to realize an electroconductive adhesive that lowers connection resistance in various kinds of thermocurable curing resins. However, it is possible to provide an electroconductive adhesive, in the case where the adherend is nickel or the like, which reduces connection resistance in various kinds of thermocurable curing resins while simultaneously maintaining storage stability to have good handleability. The present description provides a thermocurable electroconductive adhesive including the following components (A) to (D): Component (A): a curable resin, Component (B): a thermal curing agent that cures Component (A), Component (C): an organometallic complex, and Component (D): electroconductive particles.

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