Masayoshi Fujishima

Title: Masayoshi Fujishima: Innovator in Lead-Free Solder Technology

Introduction

Masayoshi Fujishima is a notable inventor based in Iruma, Japan. He has made significant contributions to the field of solder technology, particularly in developing lead-free solder alloys. His work focuses on enhancing the performance of electronic components, especially in terms of impact and vibration resistance.

Latest Patents

Fujishima holds a patent for a lead-free solder alloy, solder ball, and electronic member designed for automobile-mounted electronic components. This innovative lead-free solder alloy demonstrates excellent performance in impact resistance and vibration resistance. The composition of the alloy includes 1.0 to 2.0% by mass of silver (Ag), 0.3 to 1.0% by mass of copper (Cu), and 0.005 to 0.1% by mass of nickel (Ni), with the balance being tin (Sn) and unavoidable impurities. The unique structure of the solder joint allows for improved durability in electronic applications.

Career Highlights

Fujishima has worked with prominent companies in the materials and electronics sectors. He has been associated with Nippon Steel & Sumikin Materials Co., Ltd. and Nippon Micrometal Corporation. His experience in these organizations has contributed to his expertise in developing advanced solder materials.

Collaborations

Fujishima has collaborated with notable colleagues, including Masamoto Tanaka and Tsutomu Sasaki. Their combined efforts have furthered research and development in solder technology.

Conclusion

Masayoshi Fujishima's contributions to lead-free solder technology have made a significant impact on the electronics industry. His innovative approaches to enhancing solder performance continue to influence the development of reliable electronic components.