The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Mar. 08, 2007
Masamoto Tanaka, Futtsu, JP;
Tsutomu Sasaki, Futtsu, JP;
Takayuki Kobayashi, Futtsu, JP;
Kazuto Kawakami, Futtsu, JP;
Masayoshi Fujishima, Iruma, JP;
Masamoto Tanaka, Futtsu, JP;
Tsutomu Sasaki, Futtsu, JP;
Takayuki Kobayashi, Futtsu, JP;
Kazuto Kawakami, Futtsu, JP;
Masayoshi Fujishima, Iruma, JP;
Nippon Steel & Sumikin Materials Co., Ltd., Tokyo, JP;
Nippon Micrometal Corporation, Saitama, JP;
Abstract
A lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also provided are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free alloy. Specifically, the lead-free solder alloy consists of 1.0 to 2.0% by mass of Ag, 0.3 to 1.0% by mass of Cu, 0.005 to 0.1% by mass of Ni and the balance including Sn and unavoidable impurities. In an Sn—Ag—Cu based solder joint portion on a Cu electrode, a CuSn intermetallic compound layer is formed directly on the Cu electrode, and then a CuSnintermetallic compound layer is formed thereon. A Cu atomic site in the CuSnintermetallic compound layer is replaced by Ni having a smaller atomic radius than Cu to thereby reduce strain in the CuSnintermetallic compound layer, thus enabling impact resistance and vibration resistance to be improved therein.