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For the Inventor, By the Inventor

Tokyo, Japan

Masaya Shimamura

USPTO Granted Patents = 16 

Average Co-Inventor Count = 4.8

ph-index = 4

Forward Citations = 98(Granted Patents)


Company Filing History:

goldMedal15 out of 1,765 
 
Taiyo Yuden Co., Ltd.
 patents
silverMedal1 out of 24 
 
Taiyo Yudenco., Ltd.
 patents

Years Active: 2014-2020

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16 patents (USPTO):Explore Patents
1. 10868364 - Wireless module and method for manufacturing the same (2020-12-15),
2. 10756024 - Electronic component module and method of manufacturing the same (2020-08-25),
3. 10714822 - Wireless module and method for manufacturing wireless module (2020-07-14),
4. 10665936 - Wireless module and method for manufacturing wireless module (2020-05-26),
5. 10529668 - Method of manufacturing electronic component module (2020-01-07),
6. 10490512 - Method of making plural electronic component modules (2019-11-26),
7. 9807916 - Circuit module and method of producing the same (2017-10-31),
8. 9560740 - Circuit module and method of manufacturing same (2017-01-31),
9. 9456488 - Circuit module and method of producing circuit module (2016-09-27),
10. 9455209 - Circuit module and production method therefor (2016-09-27),
11. 9101050 - Circuit module having electrical shield (2015-08-04),
12. 9101044 - Circuit module and method of producing the same (2015-08-04),
13. 9055682 - Circuit module (2015-06-09),
14. 9018039 - Circuit module and method of producing circuit module (2015-04-28),
15. 8897019 - Circuit module (2014-11-25),

Title: Unveiling the Ingenious Mind of Inventor Masaya Shimamura

Introduction:

Masaya Shimamura, a skilled inventor hailing from Tokyo, Japan, has made remarkable contributions in the field of technology with a total of 16 patents to his name. His innovative spirit and dedication to advancing electronic components have solidified his reputation as a pioneering figure in the industry.

Latest Patents:

1. Wireless module and method for manufacturing the same: Shimamura's groundbreaking solution involves the intricate process of preparing a substrate, covering specific regions with resin material, curing it to form a resin layer, and applying a shielding material. This method results in a finely polished surface conducive to optimal electronic component mounting.

2. Electronic component module and method of manufacturing the same: This patent showcases Shimamura's expertise in creating an electronic component module with a distinct sealing portion, contact portion, removal portion, and shielding film. The design allows for efficient electrical connections and protection of crucial components.

Career Highlights:

Currently employed at Taiyo Yuden Co., Ltd., Shimamura's innovative prowess is further amplified by his association with this leading technology company. His tenure at Taiyo Yuden Co., Ltd. has fostered an environment where cutting-edge ideas are nurtured and brought to life.

Collaborations:

Shimamura has collaborated closely with esteemed colleagues such as Takehiko Kai and Eiji Mugiya. Together, they have worked tirelessly to push the boundaries of technological innovation and enhance the functionality of electronic components.

Conclusion:

In conclusion, Masaya Shimamura's inventive spirit and remarkable portfolio of patents underscore his unwavering commitment to driving technological progress forward. His impactful contributions continue to shape the landscape of electronic components, cementing his legacy as a visionary inventor in the field.

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