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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10868364 B1

PDFFull Text
Date of Patent:
Dec. 15, 2020

Filed:

Nov. 30, 2017

Wireless module and method for manufacturing the same

Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Takehiko Kai, Tokyo, JP;

Masaya Shimamura, Tokyo, JP;

Mikio Aoki, Tokyo, JP;

Jin Mikata, Tokyo, JP;

Taiji Ito, Tokyo, JP;

Assignee:

TAIYO YUDEN CO., LTD., Tokyo, JP;

Attorney:

Chen Yoshimura LLP

Primary Examiner:

Ab Salam Alkassim, Jr

Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 1/52 (2006.01); H01Q 1/22 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/526 (2013.01); H01L 23/3121 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01L 2223/6677 (2013.01); H01Q 23/00 (2013.01);
Abstract

Solution is preparing a substrate; covering an electronic component mounting region and an antenna mounting region of the substrate with a resin material having viscosity or fluidity; curing the resin material to form a resin layer, and thereafter performing grinding or polishing so as to substantially flatten a surface of the resin layer on the electronic component mounting region and the antenna mounting region; and covering the flattened resin layer with a shielding material having viscosity or fluidity.

Find Patent Forward Citations

Kai, Takehiko. (2020). Wireless module and method for manufacturing the same (U.S. Patent No. 10868364). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10868364

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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