The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2020
Filed:
Nov. 30, 2017
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventors:
Jin Mikata, Tokyo, JP;
Masaya Shimamura, Tokyo, JP;
Mikio Aoki, Tokyo, JP;
Takehiko Kai, Tokyo, JP;
Taiji Ito, Tokyo, JP;
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01L 23/31 (2006.01); H01Q 1/22 (2006.01); H01Q 9/42 (2006.01); H01Q 1/52 (2006.01); H01L 23/552 (2006.01); H01L 21/56 (2006.01); B32B 15/08 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/552 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/526 (2013.01); H01Q 9/42 (2013.01); B32B 15/08 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/3511 (2013.01); H01Q 23/00 (2013.01);
Abstract
A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate and serving as an antenna; a resin layer sealing the electronic circuit in the first region; and a shielding layer formed on a surface of the resin layer and having conductivity.