The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Nov. 26, 2013
Taiyo Yuden Co., Ltd., Tokyo, JP;
Kenzo Kitazaki, Tokyo, JP;
Masaya Shimamura, Tokyo, JP;
Eiji Mugiya, Tokyo, JP;
Takehiko Kai, Tokyo, JP;
Taiyo Yuden Co., Ltd., , JP;
Abstract
A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.